High-Performance Chill Block for Power Tab Semiconductors

Our Chill Block with Power Tab represents the evolution of compact liquid cooling for power semiconductors. Engineered specifically for Power Tab package devices, this chill block delivers exceptional cooling performance in an ultra-compact form factor. The design focuses on minimizing thermal resistance while maximizing ease of integration into modern high- density electronics. Whether cooling MOSFETs, IGBTs, or power diodes, this chill block provides the thermal headroom needed for peak performance and extended component life.

How It Works

The Chill Block with Power Tab employs a sophisticated internal channel structure that creates a high-surface-area interface between coolant and the aluminum base. Coolant enters through an inlet port and is distributed across multiple parallel microchannels positioned directly beneath the Power Tab contact area. This microchannel array creates extensive fluid- to-metal contact area, dramatically increasing convective heat transfer efficiency. As coolant flows through these channels, it absorbs heat conducted through the base from the semiconductor's Power Tab. The low-profile design minimizes the conduction path length, reducing thermal resistance. Advanced brazing techniques ensure structural integrity while maintaining excellent thermal conductivity throughout the assembly. Exit manifold design ensures uniform flow distribution across all channels, preventing flow bypass that could create thermal hotspots.

Key Features

• Microchannel Technology:Dense internal channel array maximizes heat transfer surface area
• Ultra-Low Thermal Resistance:Optimized for maximum heat extraction in minimal space
• Universal Power Tab Compatibility:Accommodates standard Power Tab semiconductor packages
• Minimal Height Profile:Low-profile design ideal for space-limited applications
• Robust Construction: Brazed aluminum construction ensures leak-free operation
• Efficient Flow Design:Parallel channel architecture minimizes pressure drop
• Easy Integration:Standard footprint simplifies PCB layout and assembly
• Multiple Coolant Options:Compatible with various cooling fluids including water and glycol mixtures