Integrated Cooling for IGBT & Diode Power Modules

Chiller Plate 4 Igbt

Product Overview

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Our Chiller Plate for 4 IGBT + 3 Diode modules represents an integrated thermal solution for complex power electronics assemblies. This specialized cold plate provides dedicated cooling zones for both IGBT and diode components in a single, optimized platform. Ideal for advanced power conversion systems, this design eliminates the need for multiple separate cooling solutions while ensuring optimal thermal performance for each component type.

How It Works

This advanced chiller plate features seven distinct thermal zones engineered to address the unique cooling requirements of IGBTs and diodes. The internal channel network is strategically routed to provide preferential cooling where needed most, accounting for the different power dissipation characteristics of IGBTs versus diodes. Coolant enters through a manifold that distributes flow proportionally to each zone based on anticipated thermal loads. The diode zones feature optimized channel geometry that accommodates their typically lower heat flux while maintaining efficient heat extraction. IGBT zones receive enhanced flow rates through larger cross-section channels positioned directly beneath high-heat-density areas. This intelligent thermal architecture ensures all seven components operate within optimal temperature ranges simultaneously.

Key Features

  • Icon7-Zone Thermal Design:Dedicated cooling for 4 IGBTs and 3 diodes in one integrated platform
  • IconOptimized Flow Distribution:Intelligent channel routing balances cooling across component types
  • IconPrecision Component Registration:Accurate mounting positions for both IGBT and diode packages
  • IconThermal Load Balancing:Engineered flow rates account for different power dissipation profiles
  • IconCompact Integration: Single cold plate solution reduces system complexity
  • IconHigh Reliability Construction:Vacuum brazed aluminum or copper for zero-leak performance
  • IconEnhanced Flatness Tolerance:Ultra-precise mounting surfaces across all seven zones
  • IconModular Connectivity:Flexible manifold options for series or parallel flow configurations

Technical Specifications

  • IconComponent Positions:4 IGBT zones + 3 diode zones
  • IconMaterial Construction:Aluminum 6061-T6, Copper C110, or hybrid designs
  • IconOperating Temperature:-40°C to +125°C continuous
  • IconPressure Rating:12 bar (175 psi) maximum
  • IconRecommended Flow Rate:3-12 LPM total
  • IconThermal Resistance:<0.05°C/W per zone (typical)
  • IconMounting Surface Flatness:<20 microns across all zones
  • IconPort Options:Multiple inlet/outlet configurations available
  • IconTesting Standard:100% pressure tested and leak-free certified
  • IconCoolant Compatibility:Water-glycol mixtures, DI water, dielectric fluids
  • IconQuality Standard:100% helium leak tested

Applications

  • IconThree-phase inverters for industrial drives
  • IconAdvanced motor control systems
  • IconGrid-tied solar and wind inverters
  • IconElectric and hybrid vehicle powertrains
  • IconEnergy storage system inverters
  • IconRail transportation power conversion
  • IconIndustrial welding power supplies
  • IconHigh-power UPS systems
  • IconMedical imaging equipment power supplies
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