Our Chiller Plate for 4 IGBT + 3 Diode modules represents an integrated thermal solution for complex power electronics assemblies. This specialized cold plate provides dedicated cooling zones for both IGBT and diode components in a single, optimized platform. Ideal for advanced power conversion systems, this design eliminates the need for multiple separate cooling solutions while ensuring optimal thermal performance for each component type.
This advanced chiller plate features seven distinct thermal zones engineered to address the unique cooling requirements of IGBTs and diodes. The internal channel network is strategically routed to provide preferential cooling where needed most, accounting for the different power dissipation characteristics of IGBTs versus diodes. Coolant enters through a manifold that distributes flow proportionally to each zone based on anticipated thermal loads. The diode zones feature optimized channel geometry that accommodates their typically lower heat flux while maintaining efficient heat extraction. IGBT zones receive enhanced flow rates through larger cross-section channels positioned directly beneath high-heat-density areas. This intelligent thermal architecture ensures all seven components operate within optimal temperature ranges simultaneously.