Hexagonal Chill Block for Maximum Cooling Density

The Hex Chill Block Without Power Tab introduces a unique hexagonal geometry optimized for applications requiring maximum cooling capacity in constrained spaces. Unlike traditional rectangular cold plates, the hexagonal design enables efficient tessellation for cooling multiple components simultaneously. This innovative geometry provides optimal surface area utilization while maintaining structural integrity. Designed for mounting discrete components or custom heat spreaders, this chill block excels in applications where Power Tab packages are not used but high heat flux cooling is essential.

How It Works

The hexagonal geometry of this chill block provides six sides for potential component mounting or heat spreader attachment, maximizing thermal interface area relative to the block's footprint. Internal coolant channels follow the hexagonal contour, creating uniform flow distribution beneath all mounting surfaces. This geometry naturally promotes turbulent flow at lower velocities compared to rectangular designs, enhancing heat transfer coefficients. The central manifold distributes coolant radially outward to peripheral channels, ensuring balanced thermal performance across the entire hexagonal perimeter. Heat conducted into the block from mounted components or heat spreaders is rapidly absorbed by the adjacent flowing coolant. The compact hexagonal form allows close spacing of multiple blocks for array configurations, enabling scalable cooling solutions for multi-device assemblies. Precision CNC machining ensures all six faces maintain identical thermal contact specifications.

Key Features

• Hexagonal Geometry:Innovative shape maximizes cooling efficiency and tessellation capability
• Multi-Surface Mounting:Six mounting faces provide flexible component attachment options
• Uniform Flow Distribution:Radial channel design ensures balanced thermal performance
• Array Scalability:Hexagonal shape enables efficient multi-block configurations
• High Heat Flux Handling: Optimized for cooling high-power discrete components
• Versatile Mounting:Compatible with various component types and heat spreaders
• Compact Footprint:Efficient geometry minimizes required PCB or chassis space
• Structural Rigidity:Hexagonal shape provides excellent mechanical stability